Sondrel case study of a 40nm SoC design for IoT

September 28, 2017 // By Sondrel
This is a case study of a design around a CoreLink SSE-200 subsystem targeting the 40nm ULP process from foundry chip manufacturer TSMC. The purpose was to build an IoT SoC to control external communications, internal SoC management and security and provided for debug and test.
Company: 
Sondrel, design service, IoT

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