Silicon nanowire springs that stretch, keep their electrical properties

Rather than starting from Si wafers cut-out from drawn silicon ingots, they describe in their paper a nanoscale-version of the crystal-pulling methods used to grow silicon crystal ingots from molten silicon, albeit following wavy patterns pre-set in a layer of silicon oxide. The researchers started with a glass or wafer substrate, coated with a layer of silicon dioxide etched into wavy edge patterns. A small strip of indium at an extremity is then heated up so indium droplets form (under a hydrogen plasma at 300ºC), retained by the edges.

Battery sensor meets requirements for ASIL D

Electric vehicles (EVs), hybrid EVs and plug-in hybrids rely on large lithium-ion battery packs consisting of hundreds or even thousands of individual battery cells. Experts expect that 25% of the cars sold by 2025 will have an electric motor. Therefore, OEMs and Tier 1s require an intelligent battery management system for secure and cost-effective solutions with robust communication.



Sigfox<sup>®</sup> Connectivity Solutions

ON Semiconductor's Sigfox® portfolio of connectivity solutions has applications across an almost limitless number of market sectors

The portfolio includes transceivers, microcontrollers (MCUs), and system-on-chip (SoC) solutions. In addition, a range of hardware and software development tools are available to help speed and ease new designs for customers.

8SLVD1204/8SLVD1204-33 Fanout Buffers

IDT’s 2:4, high-performance differential, LVDS output fanout buffers in either 2.5 V or 3.3 V

These devices are designed for the fanout of high-frequency, very low additive phase-noise clock and data signals. Guaranteed output-to-output and part-to-part skew characteristics make the devices ideal for those clock distribution applications demanding well-defined performance and repeatability.

Intel<sup>®</sup> Cyclone<sup>®</sup> 10 LP FPGAs

Low cost and low static power FPGAs ideal for high-volume and cost-sensitive applications

Built on a power-optimized 60 nm process, Intel Cyclone 10 LP FPGAs extend the low-power leadership of the previous generation Cyclone V FPGAs. The latest generation devices reduce core static power by up to 50 percent compared to the previous generations.

BD7F Series Isolated Flyback DC-DC Converters

Eliminate optocouplers and auxiliary winding

Conventionally, in order to stabilize the output voltage of isolated power supplies, methods using optocouplers and / or auxiliary winding, are employed. ROHM has developed isolated flyback DC-DC converter controllers that eliminate the need for these types of feedback circuits.

Intel, Micron call time on 3D-NAND collaboration

However, the parting of the ways does not apply to the phase-change based 3D-XPoint memory. The two companies said they will continue to cooperate on 3D-XPoint memory at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah, which they also disclosed is now entirely focused on the production of 3D-XPoint memory.

SMPM Series Connectors

Ideal for miniaturized, high-frequency coaxial applications

• RF performance of DC to 65 GHz • Small package size • Push-on and snap-on mating styles for quick installation • Board-to-board minimum spacing: 8.65 mm

HDC2010 Humidity and Temperature Digital Sensor

The HDC2010 provides high accuracy measurements with very low power consumption in an ultra-compact wafer level chip scale package (WLCSP)

The HDC2010 provides high accuracy measurement capability for a wide range of environmental monitoring applications and Internet of Things (IoT) such as smart thermostats, smart home assistants, and wearables.