Leti demonstrates 3D sequential integration for truly 3D chips

CEA-Leti’s 3D monolithic or 3D sequential CMOS technology, CoolCube, allows to vertically stack several layers of devices with a unique connecting-via density above tens of million/mm2. This More Moore technology is said to decrease dice area by a factor of two, while providing a 26 percent gain in power. The wire-length reduction enabled by CoolCube also improves yield and lowers costs. In addition to power savings, this true 3D integration opens diversification perspectives thanks to more integration of functions.

USB-C combo buck-boost battery charger targets mobile computing systems

Through firmware control, the ISL9241 can switch between NVDC and HPBB modes, providing a low-cost and small solution size capable of efficiently processing a full range of power levels. It leverages the company’s advanced R3 modulation technology for superior light-load efficiency and ultra-fast transient response to extend battery run-time. The charger’s reconfigurable internal registers allow the use of a smaller inductor for HPBB mode to achieve higher efficiencies across multiple power levels.

Firmware eases industrial-grade TSN network configuration

Tool-assisted configuration with the MultiConfig tool in Industrial HiVision enables TSN configuration without laboriously logging in to each device and setting parameters, such as time synchronization and the TSN schedule, individually. The combination of Industrial HiVision and the TSN firmware on the switches makes TSN actually usable in production as well as evaluation. With an extension to the integrated dashboard function, Industrial HiVision can visualize TSN schedules and allows the operator to monitor the TSN operation.

Neural network accelerator scales up multi-core AI

A single Series3NX core scales from 0.6 to 10 tera operations per second (TOPS), while multicore implementations can scale beyond 160 TOPS, claims the company.

Thanks to architectural enhancements, including lossless weight compression, the Series3NX architecture benefits from a 40% boost in performance in the same silicon area over the previous generation, giving SoC manufacturers a nearly 60% improvement in performance efficiency and a 35% reduction in bandwidth.

Display controller is optimized for in-vehicle HUD

The SC1711 was designed to meet the specific needs of HUDs, with features such as Socionext's high-performance 2D graphics engine SEERIS, and APIX2 high-speed serial interface supporting data rates of 1Gbps (down) and 187.5Mbps (up). The company optimized the functionality and performance of the SC1711 for medium resolution displays (24bit 1280x480 at 60fps) which are used for HUDs, and integrated these features into a compact 20x20mm package. The package meets the rigorous requirement of dashboard devices used in the harsh temperature environment.

Tax break draws crowdfunding Nanusens to UK

Nanusens has raised more than €1 million via the Crowdcube scheme as reported by eeNews Europe back on June (see Nanusens raises €1 million via crowd funding). This money came from 786 people with the majority of them being tech-savvy investors who wanted to obtain tax relief under the UK government's Enterprise Investment Scheme, according to Josep Montanyà i Silvestre, CEO of Nanusens Ltd.

BASF organics boost Plastic Logic displays

Plastic Logic has demonstrated two mass-producible six-inch displays; in 300dpi greyscale and 150dpi colour versions. However, it is notable that the colour displays appear somewhat "washed out" and not as vibrant as OLED displays. This may limit applications for the display to those where monochrome displays are sufficient and flexibility, even scrollability, are desirable.

Philips doubles down on booming VCSEL market

The company did not indicate whether that would include and increase in wafer diameter or simply the installaton of more machine. Nor did the company say how much it expects to spend on the upgrade. Demand is being driven by the adoption of facial recognition technology in consumer smartphones and increased adoption of optical interconnects in data centers, Philips said.

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