Philips doubles down on booming VCSEL market

The company did not indicate whether that would include and increase in wafer diameter or simply the installaton of more machine. Nor did the company say how much it expects to spend on the upgrade. Demand is being driven by the adoption of facial recognition technology in consumer smartphones and increased adoption of optical interconnects in data centers, Philips said.

Samsung renews investment in Texas fab base

The Austin city council has approved a resolution designating Samsung's fab a Texas Enterprise Zone and therefore allowing Samsung to get a refund on its state sales and use tax. Samsung gained the same approval in 2016 when it agreed to invest $1 billion in its Austin wafer fab.

Samsung said this time around it plans to spend $108 million on chipmaking tools and equipment and $183 million on facility renovations.

TSMC embedded MRAM at 28nm

Lin Yang, chief scientist with Gyrfalcon, told eeNews Europe in a telephone interview that the company could extend to analog or mixed-signal implementations of machine learning processors within a couple of years.

Gyrfalcon, founded in 2017, is already shipping its digital ASICs to customers and the 28 in the part number signifies the manufacturing process node used for the chip.

RadioVerse ADRV9009 Overview

The ADRV9009 is the widest bandwidth integrated transceiver that supports carrier-grade performance, fast frequency hopping and simplifies digital beamforming. It offers a common-platform solution for 2G/3G/4G/5G, massive MIMO and phased array radar.

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Siemens acquires COMSA to expand automotive EDA offering

The COMSA team and technology will join the Mentor business, part of Siemens PLM Software, where it will add key harness engineering and design data analytics capabilities to the Siemens product range.

“The acquisition of COMSA is part of Siemens’ continued investment in technology for the automotive industry,” said Tony Hemmelgarn, president and CEO of Siemens PLM Software.

Bluetooth - TDK Corporation

TDK’s VLS-AF series wire wound ferrite inductors for Class-D amplifiers

VLS-AF series inductors were designed for use in Class-D amplifiers of AI & Bluetooth™ speakers, television speakers, and more. These wire wound power inductors are magnetically shielded with a ferrite core and are compatible with high-density mounting.

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