The Apollo 1200's both junction temperature and thermal decay are minimized due to the device's low 0.006°C/W thermal resistance, allowing more than 120 000 lumens to be emitted from a single LED COB module. The new Apollo 1200 high performance COB modules enable energy-efficient LED technology to replace metal halide lamps in extremely high power lighting applications such as high mast, stadium lighting, airport and shipping terminal lighting, maritime lighting, and more.
Flip Chip Opto's patented 3-Pad Flip Chip and Pillar MCPCB technologies enable Apollo 1200 to perform high power lighting with low thermal resistance. Unlike conventional LED modules that must dissipate LED heat through MCPCB’s thermal-resistant dielectric layer, Flip Chip Opto’s 3-Pad technology creates an extra thermal pad beside two electrode pads, and uses it to couple the heat directly from LED into the metal core of the underlying MCPCB. The innovation results in low thermal resistance that enables the feasibility of brighter output, less thermal decay, longer service life, and the coordination with smaller heatsink.
The thermal performance allows the Apollo 1200 to achieve the lumen output between 107 080 and 121 680 lumens at 1200 Watt depending on the choice of color temperature (CCT) and color rendering index (CRI). Such unparalleled brightness from a single LED COB enables LED lighting to penetrate into the high power/wattage market including applications such as high mast lighting, stadium lighting, airport and shipping terminal lighting, maritime lighting and more.
Lower thermal resistance presented by the 3-Pad technology not only minimizes the thermal decay but also boosts the brightness by allowing more driving current while still maintaining LED junction temperature (Tj) below its thermal threshold. Compared to conventional wire-bonded COBs, Apollo 1200 of 3-Pad technology is able to sustain higher driving current with minimal Tj increase, and therefore produce more light under the same Tj restriction. Meanwhile, lower thermal resistance also exhibits the opportunity to coordinate with a smaller heatsink that represents