Sampling now, the 13.23x8.97mm IMX324 image sensor is capable of approximately three times the horizontal resolution of conventional products, supporting the high-definition image capture of distant road signs approximately 160 meters ahead of the camera.
A pixel binning mode further raises the sensitivity in low-light environments, reaching a sensitivity of 2666mV, making it possible to capture images of pedestrians and obstacles even in low-light environments as low as 0.1 lux. For scenes with varying levels of brightness, a function alternately captures dark sections at high-sensitivity settings and bright sections at high resolution, which can then be processed into high-precision image recognition.
It is the first time in the industry that a stacked configuration is employed on an automotive grade sensor, claims Sony Semiconductor, who arranged the pixel array and signal processing circuit in layers created at different technology nodes for design optimization.
The image sensor is expected to be compatible with the "EyeQ4" and "EyeQ5" image processors currently being developed by Mobileye for use in ADAS and autonomous vehicle technology.
It is planned to meet the AEC-Q100 Grade 2 reliability testing standards for automotive electronic components by June 2018. The sensor comes with a security feature that protects the output image from being altered.
Sony Semiconductor - www.sony-semicon.co.jp