7nm low power process on schedule with EUV at Samsung

September 11, 2017 // By Julien Happich
Samsung Electronics announced it has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, broadening the range of options for customers' next-generation products.

Through further scaling from the earlier 14LPP process, 11LPP is said to deliver up to 15 percent higher performance and up to 10 percent chip area reduction with the same power consumption.

In addition to the 10nm FinFET process for mobile processors in premium flagship smartphones, the company expects its 11nm process to bring differentiated value to mid- to high-end smartphones. The new process technology is scheduled to be ready for production in the first half of 2018.

The South Korean company also confirmed that development of a 7nm LPP process requiring EUV lithography is on schedule, targeting its initial production in the second half of 2018.

The company has processed close to 200,000 wafers with EUV lithography technology since it started in 2014, consistently improving yield, up to 80 percent for 256Mb SRAM (static random-access memory).

Samsung will detail its foundry roadmap, including 11LPP availability and 7nm EUV development at the Samsung Foundry Forum Japan on September 15, 2017, in Tokyo.

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