80x80 pixels thermal sensor ready for large-volume applications

September 06, 2016 // By Julien Happich
Delivered in a Ball Grid Array (BGA) wafer level package, the fully digital Micro80 Gen2 thermal sensor from ULIS is claimed to be the first infrared sensor box packaged in a JEDEC tray, making it suitable for large-volume applications.

The device supports optical fields of up to 120° and is claimed to be the first infrared sensor with a unique plastic lens holder, eliminating the need for OEMs to develop their own, thus saving time and lowering costs.
The Micro80 Gen2 consumes less than 55mW and operates in the -40 to +85ºC temperature range. It supports a broad spectrum of frame rates (from 1Hz to 50 Hz) and allows vision up to 150 meters.  
Thanks to its 80x80 pixels grid, the thermal sensor can distinguish humans from animals or robots in all-weather and lighting conditions, 24/7 – without compromising privacy. This makes it suitable for occupancy detection in connected buildings, amongst other potential applications. The sensor supports standardized interfaces such as I 2C and HSync/VSync clocking.

Visit ULIS at www.ulis-ir.com