The processor will be an Intel H-series processor, a Radeon GPU and high bandwidth memory (HBM) in a single interposer-based component.
The design is the first instantiation of something Intel calls the Embedded Multi-die Interconnect Bridge (EMIB) that allows heterogeneous silicon in extremely close proximity to pass information more quickly than previous systems. It provides for higher performance and lower power in thinner form factors. There is also a power-sharing framework that monitors and coordinates workload among the processor, discrete graphics chip and dedicated graphics memory.
Additionally, this solution is the first mobile PC processor to use HBM2, which consumes less power and takes up less space compared to traditional discrete graphics-based designs using dedicated graphics memory such as GDDR5 memory.
AMD said Intel expects the processor to launch in the first quarter of 2018.
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