The Tempus Timing Signoff Solution represents a new approach to timing signoff tools that enables customers to shrink timing signoff closure and analysis for faster tapeout while producing designs with less pessimism, area and power consumption.
“Today, the time spent in timing closure and signoff is approaching 40 percent of the overall design implementation flow. Traditional signoff flows have failed to keep pace with the increasing demands of achieving timing closure on complex designs,” said Anirudh Devgan, corporate vice president for Silicon Signoff and Verification for the Silicon Realization Group at Cadence. “The Tempus Timing Signoff Solution represents a significant advancement in timing signoff tool innovation and performance, leveraging multi-processing and ECO features to achieve signoff faster than with traditional flows.”
Tempus is the the first massively distributed parallel timing engine on the market, which can scale to use up to hundreds of CPUs. The parallel architecture enables the tools to analyze designs in the hundreds of millions of instances without compromising accuracy.
A new path-based analysis engine leverages multi-core processing to reduce pessimism. With its performance advantage, the Tempus Timing Signoff Solution enables broader use of path-based analysis. Multi-mode, multi-corner (MMMC) analysis and physically-aware timing closure leverages multi-threaded and distributed timing analysis.
The Tempus Timing Signoff Solution advanced capabilities can handle designs containing hundreds of millions of cell instances without compromising accuracy. Initial engagements with customers have shown the tool can achieve timing closure in days on a design that would have taken several weeks with traditional flows.
“We are pleased to see new capabilities in the area of static timing analysis (STA) from Cadence,” said Sanjive Agarwala, director of processor development at Texas Instruments. “As we move to more advanced process nodes, timing closure becomes more difficult. It’s great to see Cadence taking on this challenge by offering new technology designed to tackle tough design closure issues.”