By leveraging a mix of Lattice’s FPGA, ASSP and programmable ASSP (pASSP) products in a single, modular platform, the triple-board stack provides the right balance of flexibility and energy efficiency required for a variety of embedded vision applications in the industrial, automotive and consumer markets, claims the manufacturer.
The kit combines the CrossLink pASSP mobile bridging device, the ECP5 low power, small form factor FPGA, along with a high-bandwidth, high resolution HDMI ASSP to accelerate development of intelligent, vision-enabled devices at the edge. The CrossLink input board includes dual-camera HD image sensors supporting the MIPI CSI-2 interface, eliminating the need for external video sources. The ECP5 base board enables low-power pre/post processing and includes support for HD image signal processing (ISP) intellectual property (IP) from Helion Vision. Also included is a NanoVesta connector to support external image sensor video inputs. The HDMI output board based on the Sil1136 non-HDCP version enables connectivity to standard HDMI displays.
Lattice Semiconductor - www.latticesemi.com/evdkit