Work was started on the fab and MEMS packaging facilities back in 2012, and Hanking remains China's first 200mm MEMS wafer fab. The company now makes a number of inertial measurement units (IMUs) as well as offering MEMS design and foundry services. Hanking Electronics acquired the inertial sensor business, product lines and associated patents from Maxim Integrated Products in 2016. Maxim had obtained them when it bought Austrian company SensorDynamics AG in 2011, but made the decision to exit the consumer MEMS business in 2015.
The MEMS wafer fab is 500,000 square meter facility set in 51 hectares of land. Its process capabilities cover those needed for MEMS pressure sensors, accelerometers, gyrocopses, flow sensors and custom services are available for foundry customers. Hanking has an R&D center in Cleveland Ohio and engineering teams in Milan and Pisa, Italy.
Hanking is not making explicit the production capacity of its wafer fab or the mix of own-brand to foundry wafers. Back in 2012 when the fab construction was starting the parent company pledged to spend about $475 million across three phases of development there.
The first phase was due to enable production of 4,000 wafer starts per month. These would be 200mm-diameter wafers although the building was intended to be capable of running 300mm-diameter wafers.
SensorDynamics held numerous patents for MEMS sensor technology and had devoted more than 800 man‐years of research and development to the high‐growth fields of MEMS sensors and associated low-power interface and wireless connectivity solutions.
The acquisition has enabled Hanking to expand into automotive and high-end consumer markets. It also explains the presence of a Hanking Electronics office in Graz, Austria.
Hanking is also a primary example of China's long-term approach to entering semiconductor component manufacturing where it has for many years had to import components and run a large deficit.
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