Those requirements drive designers to find durable solutions to package more electronics into smaller spaces; these new sockets can be exactly what they are looking for. The 315-43-1XX-41-004000 (single row) and 415-43-2XX-41-004000 (double row) sockets have 2.54mm pin spacing and are designed for through hole mounting in boards up to 1.57mm thick, providing a secure connection to the PCB. They are suitable for board stacking and wire to board applications where minimizing package height is paramount. When mated with Mill-Max' low profile headers, 335- 10-1XX-00-160000 (single row) and 435-10-2XX-00-160000 (double row), the total between the boards height is only 3.94mm. For wire to board connections the Mill-Max 380-10-1XX00-002000 (Single row) and 480-10-2XX-00-002000 (Double row) solder cup headers combine with the super low-profile sockets to achieve a total height of 6.81mm. Each receptacle is precision turned from brass alloy, has a highly reliable 4 finger, beryllium copper contact, accepts leads ranging from 38 to 56mm and is designed to withstand the rigors of rugged applications associated with portability. The insulator material is high temperature PCT, compatible with most soldering processes. Connectors are available from 1-32 positions, single row and 4 -72 positions double row. Standard plating options include tin or gold for the outer shell and gold for the internal contact providing optimal interconnect reliability.
Mill-Max - www.mill-max.com