The LFPAK33 devices also feature a significantly lower resistance responding to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability. The new package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and losses of the MOSFET. The resulting package has an ultra-compact footprint of 10.9mm 2, and because no wires or glue is used internally, operating temperatures of up to 175ºC T j max are possible. Devices can handle up to 70A, and the extensive product portfolio includes devices that range between 30V to 100V with an RDS(on) as low as 6.3 mΩ.
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