Radiation-tolerant FPGA in a ceramic quad flat pack

September 27, 2017 // By Julien Happich
Microsemi has released high-speed signal processing radiation-tolerant field programmable gate array (FPGA) engineering samples in a ceramic quad flat pack (CQFP) package.

The new CQ352 package, which conforms to the CQFP industry standard for space applications, features 352 pins to enable a more cost-effective integration than higher pin count packages and is the only CQFP package available for high-speed radiation-tolerant FPGAs in its class.

As an industry standard, the CQFP package is well-known for its ability to support a variety of space flight applications, primarily due to their lower costs of integration and well-understood assembly techniques, making CQFP easier to assemble onto the printed circuit board (PCB) than ceramic column grid array (CCGA) packages. The RTG4 FPGA in a CQ352 package is well suited to control applications which do not require a high number of inputs/outputs (I/Os), including satellites, space launch vehicles, planetary orbiters and landers and deep space probes, as well as others requiring frequent switching and a high number of temperature cycles. The new RTG4 FPGAs feature 166 3.3V general purpose I/Os, four embedded SpaceWire clock and data recovery circuits and four high-speed serialization/deserialization (SerDes) transceivers which can be used for either external physical coding sublayer (EPCS) or Peripheral Component Interconnect Express (PCIe) protocols. They also maintain the same count of look-up tables (LUTs), flip-flops, digital signal processing (DSP) math blocks and static random-access memory (SRAM) blocks as the existing CCGA package with 1,657 pins.
Microsemi -  www.microsemi.com