Rambus and Microsoft join forces on cryogenic memory

April 18, 2017 // By Julien Happich
Rambus has announced an expanded collaboration with Microsoft researchers to develop prototype systems that optimize memory performance in cryogenic temperatures.

Following their initial collaboration back in 2015, the new agreement extends joint efforts to enhance memory capabilities, reduce energy consumption and improve overall system performance.

The technologies being developed by the companies are expected to improve energy efficiency for DRAM and logic operation at cryogenic temperatures (below −180°C or −292.00 °F or 93.15 K), aimed at supporting high-performance super computers and quantum computers. Additionally, they will enable high-speed SerDes links to operate efficiently in cryogenic and superconducting domains and allow new memory systems to function at these temperatures.

“With the increasing challenges in conventional approaches to improving memory capacity and power efficiency, our early research indicates that a significant change in the operating temperature of DRAM using cryogenic techniques may become essential in future memory systems,” said Dr. Gary Bronner, vice president of Rambus Labs.

“Our strategic partnership with Microsoft has enabled us to identify new architectural models as we strive to develop systems utilising cryogenic memory. The expansion of this collaboration will lead to new applications in high-performance super computers (HPC) and quantum computers.”

 “We’re excited to continue working with Rambus and broaden our partnership to further develop technologies for memory optimisation in cryogenic temperatures,” said Doug Carmean, partner architect within Microsoft’s research organisation. “Rambus’ expertise in memory systems has helped us identify new memory architectures to meet our future requirements.”

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