Single-chip Balun for sub-1-GHz radio

December 19, 2017 // By Julien Happich
The BALF-SPI2-01D3 from STMicroelectronics integrates all the impedance-matching and filtering components needed to connect an antenna to the company's S2-LP 868-927 MHz low-power radio transceiver.

The 3.26 mm 2 single-chip balun replaces a conventional network of 16 discrete capacitors and inductors that can occupy up to 100 mm 2 of board real-estate, a footprint reduction of more than 96%. 
In addition to saving space, circuit design is greatly simplified, with no need to select component values or tackle exacting layout challenges. Fully optimized for the S2-LP, the balun comes with placement and connection recommendations that are tested and verified and can be directly replicated to maximize RF performance. The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1- x 1.55-mm chip-scale package.

www.st.com


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