Depending on the module, market prices are approximately 25 percent lower than comparable pressure contact variants. Solder bond modules are ideal for applications where the high robustness of pressure contact technology is not necessarily a must. Typical applications for the new 50 mm modules are drives, power supplies and welding.
With the release of the new 50 mm modules Infineon Technologies Bipolar complements the existing product portfolio of bipolar modules. The 50 mm variant covers current ratings from 280 A to 330 A. The 20 mm and 34 mm variants have been in production for more than two years and proven their reliability in the field. All modules have been developed as cost and performance optimized alternative to pressure contact technology. They are packaged in industrial standard housings with an electrically insulated base plate.
The new 50 mm modules as well as the 20 mm and 34 mm modules in solder bond technology (above) are available in high quantities. All modules are offered in the topologies thyristor/thyristor, thyristor/diode and diode/diode with a blocking voltage of 1600 V and in current ratings from 55 A to 330 A. Infineon is planning to release additional module types with blocking voltages of 1800 V and 2200 V in 2017.
Further information about the solder bond family is available at www.infineon.com/solderbond.