Transistor aluminium heat sinks in both extruded and stamped versions

May 30, 2017 // By Julien Happich
CUI’s Thermal Management Group has expanded its existing portfolio of Peltier devices and DC fans with the addition of a new line of aluminium heat sinks, available in both extruded and stamped versions, compatible with TO 218, TO 220, TO 252, and TO 263 transistor packages.

Designed to improve the heat dissipation of low and high power board level applications, these stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems.
The extruded and stamped heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.
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