The company's MLX75023 and MLX75123 ToF chipset enables real-time 3D imaging at full QVGA resolution with a field of view up to 110º. The 80x50x35mm modular evaluation kit features a complete camera built around this chipset and can be directly connected to a PC for live visualization and recording of depth map data (at 60fps), while allowing direct access to many configuration settings. Background light rejection is up to 120klux.
It consists of four stacked PCBs (from top to bottom: illumination board with 4 VCSELs, TOF chipset board, interface board and a processor board). The top two PCBs can be detached from the bottom two PCBs by bypassing the board to board connection with an external cable suitable for FPD-Link III communication. A graphical user interface is provided for Windows and a MATLAB SDK and C API are also provided for custom SW development.
More information at: https://www.melexis.com/en/news/2017/18jan2017-tof-chipset-and-evalution-kit
Melexis – www.melexis.com