Thermal Management in High Performance RF and Microwave PCBs

July 26, 2020 // By John Priday CTO, Teledyne Labtech
Thermal Management in High Performance RF and Microwave PCBs

As new RF and microwave systems evolve, we are seeing a greater need for effective thermal management and significantly higher RF performance from Printed Circuit Boards (PCB’s) and subsystems; at the same time these systems are required to decrease in mass and still offer greater functionality than ever before. Constraints like these are often most acute in applications where Size, Weight and Power (SWaP) are high priorities such as military and aerospace and typically include RF power amplifiers and phased array TxRx modules. This paper reviews the various methods of thermal management and reviews in detail the advantages of “Coin” technology versus traditional thermal via technology. To complement our paper on Thermal Management in High Performance PCB, Teledyne Labtech has issued a new set of design rules to allow engineers to design thermally efficient PCB.


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