Three-level flash gives way to four in bid for greater capacity: Page 5 of 5

April 09, 2019 //By Daniel Zajcev
Three-level flash gives way to four in bid for greater capacity

The first QLC SSD

Intel was the first company to release a 3D QLC (64-Layers) NAND flash product for the mass consumer market: the 660p series. The 660p comes in the space conscious M.2 form factor and offers high capacity drives at an affordable price with PCIe NVMe performance. Due to the higher aerial density of 3D QLC and its ability to store four bits per cell, the 660p can fit up to two times more capacity in an identical M.2 footprint in comparison to an M.2 equipped with 3D TLC NAND flash. The 660p is available with 512GB, 1TB and 2TB. Due to the fast PCIe interface and NVMe protocol, the drive has sequential data rates of up to 1800 MB/s for reading and 1800 MB/s for writing. For both, random read and write, the 660p can perform up to 220k IOPS.

Other suppliers will soon be able to launch QLC based SSDs. Intel, which now develops 3D NAND memory independently of Micron, has announced its first PCIe-based QLC SSD. Toshiba Memory plans to start mass production of its BiCS4 QLC NAND flash in 2019. If you need help understanding how to apply this exciting new technology in your application, Rutronik, as a partner of Apacer, Intel, Swissbit, Toshiba, Transcend, and Wilk, can help. Our storage product managers are in close contact with leading memory vendors and can provide engineers, developers and purchasers with comprehensive support and advice to select the right memory technology.

 

About the author:

Daniel Zajcev is Product Sales Manager Storage at Rutronik - www.rutronik.com

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