1.0×0.6mm chip LEDs are only 0.2mm thin for wearables
New Products
|
By
Julien Happich
The SML-P1 series combines a lower gold wire loop with a thinner light emitting element (thinned down to 0.05mm using proprietary technology) to achieve the thinnest form factor on the market at only 0.2mm.
Taking usage conditions into consideration allowed Rohm to prevent solder intrusion into the resin during reflow, by implementing penetration countermeasures within the package itself. This is expected to prevent failures caused by solder infiltration during the customer’s soldering process, improving reliability
Visit Rohm at www.rohm.com
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
