$1.6bn for US defense chiplets
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The Texas Institute for Electronics (TIE) at The University of Texas at Austin is to develop high performance chiplets for the US Department of Defense.
A $840m contract from the US DARPA research agency will see TIE establish an open access R&D and prototyping fabrication facility for chiplets for radar, satellite imaging, unmanned aerial vehicles and other systems over the next five years.
Strategic partners in the DARPA project are AMD, Intel and Micron with equipment and material suppliers Applied Materials, Canon and Resonac as well as defense prime Raytheon.
The programme is composed of two phases — each 2.5 years in length. In Phase 1, TIE will establish the infrastructure and basic capabilities for developing chiplets. In Phase 2, the centre will engineer 3DHI hardware prototypes important to the Department of Defense and automate processes. It will also work with DARPA on separately funded design challenges.
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“DARPA’s vision for the programme includes developing an infrastructure that enables users to efficiently and accurately develop advanced microsystems meeting the defense industry’s stringent quality and reliability standards. This includes design collateral, EDA tools supporting three-dimensional constructs, and emerging capabilities like digital twins,” said John Schreck, CEO of TIE. “With the support of our consortium partners, TIE’s product development infrastructure and services will enable a true open access facility where future microsystems can be developed for a wide range of customers and can be leveraged for other programs well into the future.”
The project represents a total investment of $1.4bn with $552m from the local Texas government for two UT fabrication facilities including chiplets. These facilities will be open to industry, academia and government, and will create dual-use innovations supporting the defense sector and the semiconductor industry, including startups, advancing technology for the betterment of society.
“The University of Texas is honored to use our vast talent and expertise in service to our country,” said Kevin Eltife, chairman of the UT System Board of Regents. “This partnership will allow UT Austin faculty, staff and students to bolster our national defense and further demonstrate the University’s global leadership in technology-related teaching and research. We are grateful for the Legislature’s strong support of the Texas Institute for Electronics as it continues to feed the Texas economy and create unrivaled opportunities for Longhorns to change the world.”
“TIE is tapping into the semiconductor talent available in the Cockrell School of Engineering, in Texas and nationally to build an outstanding team of semiconductor technologists and executives that can create this national centre of excellence in 3DHI microsystems,” said S.V. Sreenivasan, TIE founder and chief technology officer and UT professor of mechanical engineering. “This includes the hiring of John Schreck, formerly senior VP at Micron Technology, as CEO. We are also investing in workforce development across Texas to create an enduring talent ecosystem that can support TIE’s future needs.”
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