100pin LPDDR4/4X memory package achieves JEDEC standard
A new package for low power DDR4 DRAM memory devices has achieved the JEDEC JED209-4 standard with a ball grid array (BGA) footprint.
The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5 x 10 mm for IoT applications requiring higher throughput in a small package.
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The LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267Mbit/s. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267Mbps offers improved performance over previous DDR4 x16 3200Mbps devices, which is especially useful for consumer applications.
Winbond guarantees the LPDDR4/4X product line will be manufactured for at least the next ten years, supporting long lifetime automotive and industrial applications.
“Winbond has been developing the memory product market for many years. We have paid great attention to our customers’ needs and the development trend of new technologies, and we have successfully developed the next generation of LPDDR4/4X by adding the new package 100BGA to fulfil the needs of emerging IoT, consumer, industrial and automotive applications,” says the company.
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