10G Ethernet PCIe 3.0 bridge chip targets industrial
Toshiba Electronics Europe has launched an Ethernet bridge chip for industrial equipment as well as automotive zonal-architecture, infotainment, telematics or gateways.
The TC9563XBG PCIe 3.0 bridge has two 10 Gbps Ethernet Media Access Controller (MAC) supporting a number of interfaces including USXGMII, XFI, SGMII, and RGMII. Both ports support Ethernet IEEE802.1 audio/video bridging (AVB) for real-time processing and low-latency IEEE802.1 time-sensitive networking (TSN) for synchronous processing.
Despite the launch of the latest PCIe 6.0 specification, the ten year old PCIe3.0 specification is still common for industrial and automotive applications, being used on the latest Alder Lake embedded boards launched last week.
Recently the use of PCIe interfaces has proliferated for device-to-device communication such as Wi-Fi, often leaving designers short of PCIe interfaces on the host SoC. Using the TC9563XBG’s 3-port PCIe switch function for these connections will address this issue and the ports also support simplified single root I/O virtualization (SR-IOV) on PCIe devices.
The TC9563XBG includes a PCIe Gen 3 switch with three external ports for communications with the host-controller SoC and additional devices equipped with PCIe interfaces like 5G-modem modules. The PCIe switch upstream port supports up to four lanes (32GT/s) for connection with the host SoC, whereas, depending on the configuration, the downstream ports can connect with one and two lanes to PCIe-capable devices.
Automotive networks are evolving toward zonal architecture that requires real-time transmission between the zones using multi-gigabit Ethernet communication, hence the dual 10 Gbps AVB and TSN Ethernet interfaces on the bridge. is ideal for next-generation automotive networking. It can also replace the existing ethernet-to-PCIe TC9560 and TC9562 bridges, thereby upgrading system throughput and performance.
Housed in a 10mm x 10mm, 0.65mm pitch P-FBGA package, the TC9563XBG bridge IC will be compliant with AEC-Q100 (Grade 3). Sample shipments started in December 2021 and volume production ramp-up will be in April 2022.
- PCIe 6.0 specification approaches release
- Deals bring PCIe 6.0 and HBM3 to FPGA prototyping
- PCIe 3.0 ATCA carrier board with Intel Core X-series processor
Other articles on eeNews Europe
- Wind River in $4.3bn Aptiv deal
- Sony teams for iSIM in cellular IoT chip
- The fastest route out of the chip shortage
- CEO Interview: Building a quantum computing leader in Europe
- Siemens teams for real time Covid-19 test
- Intel’s technology trends
- ASML fire hits EUV lithography production