112Gb/s interconnect technology for high-speed IP solutions

112Gb/s interconnect technology for high-speed IP solutions

New Products |
By Rich Pell

The combined solution, say the companies, is suited, but not limited to, high-speed communications, machine learning (ML), artificial intelligence (AI), and Industrial and Instrumentation applications. The interconnects use 112Gb/s four-level pulse amplitude modulation (PAM4) technology to pack the maximum possible bandwidth into each communication channel.

ExaMAX2 has been proven in many designs as a reliable solution for 112G speed application,” says David Jiang, Amphenol Global Product Manager for ExaMAX and ExaMEZZ. “We are very happy to work with eTopus and present this end-to-end demonstration to our customers. All selected ExaMAX2 parts are high-volume-production-ready. We are so proud that Amphenol is the first company that can provide multiple production-ready 112G high speed backplane connector solutions based on customer performance and cost requirements.”

Harry Chan, CEO of eTopus says, “We are excited to work with an industry interconnect leader like Amphenol and validate their ExaMax2 connector and 1 meter copper cable with our 112Gb/s SerDes IP. This end-to-end demonstration provides a clear upgrade path for modular platforms to double the line card bandwidth from 12.8Tb/s to 25.6Tb/s with electrical signaling and their chassis dimension.”

“We are exceptionally pleased with the low bit error rates with no channel impairment concern when utilizing the new Amphenol connector with our latest 112G ePHY SerDes,” says Chan. “Robust and reliable connections are critical to broad deployment of 112G copper connectivity.”

Amphenol ICC
eTopus Technology

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