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NXP Semiconductors has signed a strategic partnership with Foxconn Industrial Internet (FII) to supply its range of automotive technologies.

The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, with mass production in 2023.

The companies also aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP’s leading radar solutions.

Foxconn is aiming to be a significant supplier into the automotive industry, including complete vehicles. It is also looking to make its own chips, buying a fab from Macronix and has a strategic dela with Europan car maker Stellantis that owns the Fiat, Chrysler, Citroën, Opel, Peugeot and Vauxhall brands.

“FII is committed to providing clients with an automated, connected platform and big data-based technology, services and solutions, in order to create application platforms across cloud computing, mobile devices, Internet of Things (IoT), artificial intelligence (AI), smart networks, robotics and automation, among other industries,” said Brand Cheng, CEO at Foxconn Industrial Internet. “We believe that EVs and emerging technology innovation are derived from computing power, system integration, and energy management. We are pleased to join forces with NXP to strengthen the development blueprint of FII and drive innovation for connected cars by leveraging NXP’s leading automotive technology.”

“As a leading global automotive semiconductor supplier, NXP has combined its strong heritage in safety, security and quality with innovation across the vehicle’s domains,” said Ron Martino, Executive Vice President and General Manager of Edge Processing for NXP Semiconductors. “We are excited to extend the benefits of our i.MX 8 series processors for a full digital cockpit solution.to FII, a leading technology services provider, and look forward to a long-term strategic partnership, which will provide system-level solutions for the realization of next-generation automotive innovation.”

FII has also been building a cross-industry industrial Internet application platform driven by cloud computing, mobile terminals, Internet of Things (IoT), big data, artificial intelligence, high-speed network and robots.

www.nxp.com; www.fii-foxconn.com/#/

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