19” subracks for tough mobile applications
The 19” subracks in the HeiPac Vario series permit a wide range of application options with a minimum of components. The modular concept is based on the same horizontal rails and system components for all subracks. The difference lies in the design of the side panels and installation options. All subracks are shock and vibration-tested and comply with IEC 60 297-3-101, 102 and 103.
19” subracks are especially suited for mobile applications and tough ambient conditions where robustness and reliability requirements are high. For such applications, Heitec has developed the HeiPac Vario Heavy subrack system, which features higher mechanical strength and is shock and vibration-tested in accordance with EN 50 155 and DIN EN 61587-2. Thanks to the horizontal rails with double screw fastening and reinforced mounting flange, the Heavy versions are also certified for use in railway applications. The subracks are available with a height of 3 and 6 U and can accommodate standard PCBs up to 220 mm depth with the possibility of rear mounting for installation of backplanes. An EMC version is also optionally available.
Heitec AG – www.heitec-electronics.com
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