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1mm thick active micro-cooling “fan on a Chip”

1mm thick active micro-cooling “fan on a Chip”

Technology News |
By Nick Flaherty



xMEMS Labs has developed an all-silicon, active micro-cooling fan for ultramobile devices and next-generation artificial intelligence (AI) designs.

The xMEMS XMC-2400 µCooling active microfan is 1mm thick and can be used for thermal management in with smartphones, tablets, and other mobile devices using a piezo micromachines structures.

“Our revolutionary µCooling ‘fan-on-a-chip’ design comes at a critical time in mobile computing,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Thermal management in ultramobile devices, which are beginning to run even more processor-intensive AI applications, is a massive challenge for manufacturers and consumers. Until XMC-2400, there’s been no active-cooling solution because the devices are so small and thin.”

The XMC-2400 measures just 9.26 x 7.6 x 1.08 millimeters and weighs less than 150 milligrams, making it 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.

xMEMS µCooling is based on the same fabrication process as the xMEMS Cypress full-range micro speaker for ANC in-ear wireless earbuds, which will be in production in Q2, 2025 with several customers already committed to the device.

 

MEMS microspeaker for wearables weighs 56mg

xMEMS plans to sample the XMC-2400 microfan to customers in Q1, 2025.

“We brought MEMS micro speakers to the consumer electronics market and have shipped more than half a million speakers in the first 6 months of 2024,” Jiang continued. “With µCooling, we are changing people’s perception of thermal management. The XMC-2400 is designed to actively cool even the smallest handheld form factors, enabling the thinnest, most high-performance, AI-ready mobile devices. It’s hard to imagine tomorrow’s smartphones and other thin, performance-oriented devices without xMEMS µCooling technology.”

xMEMS has over 150 granted patents worldwide for its technology

xmems.com.

 

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