2-in-1 MEMS accelerometer for wearables and trackers
STMicroelectronics has combined two MEMS accelerometer structures for more accurate sensing in wearable devices.
The LSM6DSV80X combines structures for 16g and 80g full-scale sensing, a gyroscope with up 4000dps and edge AI processing in a single 14-pin LGA package measuring 2.5mm x 3mm x 0.86mm.
The dual accelerometer enables the measurement of events ranging from slight movements to intense impacts with equal accuracy. The low-g accelerometer tracks and identifies activities like walking, running, and gesture-based interactions, while the high-g measurement handles energetic movements that can saturate conventional sensors.
This targets the LSM6DSV80X at applications in sports equipment, such as monitoring performance while running or jumping. Downhill running and explosive activities like plyometrics can involve impacts over 30g, placing high stress on knees and ankles that can now be recorded easily and cost effectively. In boxing, where impacts often exceed 60g, athletes can now capture data using commercially available wearables to improve strength and power, as well as detecting concussions to increase safety. Sports such as tennis can benefit from intensity impact measurements for insights to improve racquet control and acceleration for greater speed and accuracy.
The LSM6DSV80X also integrates a MEMS gyroscope and digital processing with sensor fusion low power (SFLP) that enables spatial orientation detection and gesture detection. A machine-learning core (MLC) and finite-state machine (FSM) provide edge AI processing in the sensor to boost performance and save power by processing the raw data locally.
This permits fuller analysis of sports training, checking how accurately the athlete is performing the exercises. The sensor also features adaptive self-calibration (ASC) to adjust for different activity scenarios.
Support for the LSM6DSV80X is included in the ST MEMS Studio, a free graphical environment that provides tools for configuring the sensor, training the MLC decision tree, and testing. ST also provides a selection of affordable evaluation boards that can host the new sensor with an adapter board, including the Professional MEMS tool (STEVAL-MKI109D) and SensorTile.box PRO (STEVAL-MKBOXPRO).
Samples of the LSM60DSV80X are available now and volume production is scheduled by the end of April 2025.
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