22nm FPGAs aim at the high-end in Europe

New Products |
By Peter Clarke

Gowin Semiconductor has launched a range of 22nm FPGAs aimed at high end applications.

The Arora V FPGA family come with 270Mbps-12.5Gbps high speed serdes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

The Chinese company recently signed a deal with WPG EMEA, part of WPG Holdings, the world’s largest semiconductor distributor, as a pan-European distributor. 

“WPG EMEA is a demand creation focused distributor building a strong and disruptive technology portfolio, Gowin is a very welcome addition,” said Nigel Watts, President EMEA for WPG. “The EMEA market has long been regarded as a target rich environment for FPGA and other programmable logic vendors, the technology portfolio of Gowin provides customers access to replacement products for existing designs as well as disruptive solutions for new design opportunities.” 

WPG joins Rutronik, as well as a number of independent local distributors.

“We are really excited to be joining forces with WPG at this important time in Gowin Semiconductor’s corporate development” said Mike Furnival, Vice President of International Sales at WPG. “There are clear gaps in the FPGA market as previously established manufacturers in the low and mid-range space focus on higher density solutions. Gowin’s aggressive pursuit of innovative solutions in these markets coupled with the enthusiasm and drive of WPG should provide our customers with much higher level of service and support.”

“The FPGA market has needed new blood for a very long time, the acquisitions of Altera by Intel and Xilinx by AMD, have created the opportunity for another strong player to enter the market offering customers choice and competition, Gowin certainly fits that profile,” said Watts. 

The first device, the GW5AT-138FC676, features 138K LUT logic resources, 6.4Mbytes of block RAM, 1.1Mbytes of distributed SRAM, along with advanced DSP blocks, and an integrated ADC. Future family devices include 25K (non-Serdes) and 60K LUT devices.

Arora V integrates many hardwired modules as well as soft IP solutions for various interfaces such as PCIe 2.1, MIPI DSI, DDR3, SGMII, XAUI, Gbe, SDI and USB3.1.

“Having entered and now proliferated in the low and mid density FPGA market space, this family further enhances our leadership position and is based on genuine innovation with advanced development,” said Jason Zhu, CEO, of Gowin.

“The Arora V family integrates many innovative hard core modules that have been developed internally by Gowin, including fully controllable high-speed serdes ideal for supporting applications requiring very high data rates such as communication, video aggregation, and AI computing acceleration. New architecture DSP modules, block RAM modules supporting ECC error correction, high performance multiple voltage GPIO, and high accuracy clock architecture are all featured in Arora V,” said TP Wang, CTO of Gowin.

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