
All ECC SDRAM devices are available in a common bit-width of x8 or x16 in a standard TSOP 54 Pin package, but are also available in the space-saving x32 configuration which is packaged either in TSOP 86 pin or BGA 90 ball housing, especially for applications having limited board-space. As a standard, all ECC DRAM components allow to be operated at industrial temperatures of -40 to +85°C, but due to their high reliability are also available for temperature-ranges as high as 125°C, which is rare and unique in the DRAM industry. Any application that uses DRAM memory in DDR1, DDR2, DDR3 or LPDDR – and now also legacy SDRAM – technology, can be lifted up to a server-like reliability-level by simply using Intelligent Memory’s ECC DRAM components instead of conventional DRAMs. No software and no hardware modifications required.
Intelligent Memory – www.intelligentmemory.com
