28nm CoWoS-based all programmable 3D ICs reach volume production
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These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) 3D IC process that produces significant silicon scaling, power and performance benefits by integrating multiple components on a single device. Xilinx sees this achievement at 28nm as a logical step to further scaling with TSMC’s proven 20SoC and 16FinFET processes.
“Collaborating with TSMC to successfully reach CoWoS volume production cements Xilinx’s position as both a pioneer and industry leader in 3D IC technology and products,” said Victor Peng, senior vice president and general manager of products at Xilinx. “Working together, we have honed the procedures and technologies to produce the next generation of groundbreaking, CoWoS-based 3D ICs, and are now positioned to leverage TSMC’s 20SoC and 16nm FinFET process with our UltraScale architecture to further our industry lead.”
Xilinx’ Virtex-7 HT FPGAs feature up to sixteen, 28Gbps and seventy–two, 13.1Gbps transceivers, making them a single-package solution for high-bandwidth, high-speed Nx100G and 400G line card applications in optical transport networks.
Visit TSMC at www.tsmc.com
Visit Xilinx at www.xilinx.com
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