3-D interconnect forum to improve information sharing between standards organisations
The Standards Dashboard is to promote development of standards for heterogeneous 3-D integration with via participating partners: IEEE Standards Association, JEDEC, SEMI, and Si2.
Due to the tremendous benefits of higher performance, increased functionality, and cost reduction, adoption of 3-D integration is rapidly spreading to a wide variety of companies across the semiconductor and MEMS industries. Despite its high potential, a lack of uniform standards and a limited understanding of key manufacturing parameters threaten to delay introduction of high-volume products.
The challenge for the standardization community is to improve information sharing of standardization processes to accelerate the development and adoption of 3-D standards.
Companies involved in 3-D production can use the 3-D Standards Dashboard to find existing standards as well as to identify and track standards development activities in areas such as design, testing and production.
“The main objective of the 3-D Standards Dashboard is to identify risk areas and determine gaps related to all necessary standards for 3-D interconnects,” said Larry Smith, Sematech’s 3-D Enablement Center manager, in a statement.
Fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers worldwide are invited to participate here.
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