30 GHz bandwidth socket for mixed pitch BGA378
The SG-BGA-7303 socket is designed for 18.2- x 9.7-mm BGA package and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 30 GHz bandwidth on all connections.
The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The small footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a simple hardware installation method so that ICs can be changed out quickly.
The SG-BGA-7303 sockets are constructed with high performance and low inductance elastomer contactor. The temperature range is -35 °C to +100 °C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 A per pin. Elastomer requires proper force for operation which is applied through a torque limiting driver via compression screw. Typical ICs that can be tested using this socket have 378 balls, 18.2- x 9.7-mm with 0.61- x 0.635-mm pitch and 27 x 14 ball array.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
