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30-V MOSFET for electric power steering systems

30-V MOSFET for electric power steering systems

New Products |
By Jean-Pierre Joosting



Magnachip Semiconductor Corporation has announced that it has begun full-scale mass production of its new 30-V MXT LV MOSFETs used in Electronic Control Units (ECUs) of Electric Power Steering (EPS) systems. This MOSFET product is being used by a global automaker.

The new 30-V MXT LV MOSFET provides a stable power supply to EPS, assisting a vehicle’s directional control through an electric motor. This product also adheres to rigorous AEC-Q101 standards and guarantees a wide operating junction temperature range between -55°C to 175°C.

The MOSFET incorporates a highly rugged trench MOSFET structure in a thick gate oxide, which offers low resistance and excellent switching characteristics. These features reduce switching noise in applications and enhance system performance with high power efficiency. Additionally, the reduced product size, enabled by applying a PDFN 33 package of 3.3- x 3.3-mm, facilitates flexible design options for ECUs.

“Magnachip’s new compact and highly reliable MOSFET for EPS applications showcases our differentiated technological capabilities,” said YJ Kim, CEO of Magnachip. “We will actively expand in the automotive sector with our innovative power offerings and stringent quality control procedures.”

Magnachip Semiconductor also recently announced two new 150-V MXT MV MOSFETs using its 8th-generation trench MOSFET technology.

These newly released 8th-generation 150-V MXT MV MOSFETs (MDES15N056PTRH, MDU150N113PTVRH) were developed by leveraging Magnachip’s cutting-edge trench MOSFET technology. In particular, the RDS(on) of MDES15N056PTRH was reduced by 22% compared to the previous generation, thereby significantly enhancing energy efficiency in applications.

By improving the core cell and termination design, the Figure of Merit (RDS(on) x Qg) of the MDES15N056PTRH and MDU150N113PTVRH has been improved by 23% and 39%, respectively, compared to the previous version. Furthermore, the adoption of surface-mount type packages, such as D2PAK-7L (TO-263-7L) and PDFN56, reduces MOSFET sizes, enabling flexible design of various applications, such as motor controllers, battery management systems (BMSs), residential solar inverters and industrial power supplies.

www.magnachip.com

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