$300m for US chiplet packaging
Projects in Georgia, California, and Arizona are to receive up to $300m to boost chiplet packaging technology development and substrate manufacturing in the US.
Each of the projects for Absolics in Georgia, Applied Materials in California and Arizona State University will see up to $100m to develop advanced substrates and packaging equipment with funding form the US CHIPS Act in the last months of the current administration.
The advanced packaging enabled by advanced substrates translates to high performance computing for AI, next-generation wireless communication, and more efficient power electronics but are not currently produced in the US. The funding aims to establish and expand US advanced packaging capability, tapping into additional investments from the private sector, bringing the expected total investment across all three projects to over $470 million.
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Absolics is developing a glass core substrate panel manufacturing in a consortium of over 30 partners and has already received $75m. Through its Substrate and Materials Advanced Research and Technology (SMART) Packaging Programme, Absolics aims to build a glass-core packaging ecosystem To leapfrog the current glass core substrate panel technology and support investments in a future high-volume manufacturing capability.
Applied Materials, along with a team of 10 collaborators, is working on developing and scaling a silicon-core substrate technology for next-generation advanced packaging and 3D heterogeneous integration. Applied’s silicon-core substrate technology has the potential to advance America’s leadership in advanced packaging and help catalyze an ecosystem to develop and build next-generation energy-efficient artificial intelligence (AI) and high-performance computing (HPC) systems in the US.
Arizona State University (ASU) in Tempe is working on fan-out-wafer-level-processing (FOWLP). the ASU Advanced Electronics and Photonics Core Facility is exploring the commercial viability of 300 mm wafer-level and 600 mm panel-level manufacturing, a technology that does not exist in as a commercial capability in the US today. The partnership is led by Deca Technologies with materials, equipment, chiplet design, electronic design automation, and manufacturing expertise.
ASU will also establish an interconnect foundry that connects advanced packaging and workforce development programs with semiconductor fabs and manufacturers.
The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) set aggressive technical targets for the substrates that all three entities are expected to meet or exceed.
“Advanced packaging is essential to the development of the advanced semiconductors that are the drivers of emerging technology like artificial intelligence,” said Laurie Locascio, director of the National Institute of Standards and Technology Director. “These first investments of the National Advanced Packaging Manufacturing Program will drive breakthroughs that address a critical need in the CHIPS for America’s mission to create a robust domestic packaging industry where advanced node chips manufactured in the U.S. and abroad can be packaged within the United States.”
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