32x8x2.75mm power-on-package targets AI processors
The Power-on-Package Modular Current Multipliers (MCMs) fit within the XPU package to expand upon the efficiency, density, and bandwidth advantages of Vicor’s Factorized Power Architecture, already established in 48V Direct-to-XPU motherboard applications by early adopters. As current multipliers, MCMs mounted on the XPU substrate under the XPU package lid, or outside of it, are driven at a fraction (e.g., 1/64th) of the XPU current from an external Modular Current Driver (MCD). The MCD, located on the motherboard, drives MCMs and accurately regulates the XPU voltage with high bandwidth and low noise. The new solution, consisting of two MCMs and one MCD, enables delivery of up to 320A of continuous current to the XPU, with peak current capability of 640A.
With MCMs mounted directly to the XPU substrate, the XPU current delivered by the MCMs does not traverse the XPU socket. And, because the MCD drives MCMs at a low current, power from the MCD can be efficiently routed to MCMs reducing interconnect losses by 10x even though 90% of the XPU pins typically required for power delivery are reclaimed for expanded I/O functionality.
Additional benefits include a simplified motherboard design and a substantial reduction in the minimum bypass capacitance required to keep the XPU within its voltage limits.
Vicor has introduced two Power-on-Package devices, the MCM3208S59Z01A6C00 Modular Current Multiplier (MCM) and the MCD3509S60E59D0C01 Modular Current Multiplier Driver (MCD). Multiple MCMs may be operated in parallel for increased current capability. The 32x8x2.75mm package and low noise characteristics of the MCM make it suitable for co-packaging with noise-sensitive, high performance ASICs, GPUs and CPUs. Operating temperature range is -40C to +125C.
Vicor Europe – www.vicorpower.com
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