3D Beauties out of IC Technology

3D Beauties out of IC Technology

Technology News |
By Wisse Hettinga

Creating 3D shapes – from boxes to tubes – out of IC technology, in extremely small form factor

The Flex-to-rigid (F2R) high-precision micro-assembly platform makes use of ultra-thin embedded electrical interconnects, that are able to bend (minimum radius: 20-50 μm). 
F2R was developed to bring complex electronic imaging functionality to the tip of smart catheters and guide wires. It is, however, just as fit for many other applications that make use of multiple electronic components.

Some examples of the F2R technology:


The F2R platform starts with common silicon processing on wafer level. Tiny silicon islands of arbitrary shape, with functional elements, are connected by extremely thin and flexible electrical polymer interconnects, that are able to bend. These interconnects are created during the wafer processing stage. F2R replaces several assembly steps, and their corresponding costs and risks. The extreme flexibility and micron-size precision lets F2R take over, where standard flex foil technology comes to an end.

More information at:


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