3D IC market growing at 18% CAGR
The 3D IC market includes MEMS and sensors, RF modules, optoelectronics and imaging, memories, high-brightness LEDs and logic and hybrid logic and memory products.
Among these products MEMS and sensors, system-in-package and system-chip logic and stacked memories accounted for 67.6 percent of market revenue share in 2012, TMR estimates. The prevalence of NAND, DRAM, image sensors and MEMS in consumer electronics means that these categories contribution to the 3D IC market is set to grow in the forecast period.
A variety of end-use industry sectors are benefitting from 3D integration including ICT, consumer electronics, automotive, aerospace, military and biomedical. In 2012 the usage by sector was led by ICT, which accounted for 24.2 percent revenue share.
Among the leaders in the market are Taiwan Semiconductor Manufacturing Co. Ltd., Xilinx Inc. and Samsung Electronics Co. Ltd. who together accounted for about 55 percent of the market in 2012 with TSMC being the leader, according to TMR.
The Asia Pacific region’s revenue share in the 3D IC market in 2012 was 40.7 percent and that too is set to grow over the forecast period.
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