£3m for UK chip packaging R&D centre

£3m for UK chip packaging R&D centre

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By Nick Flaherty

The University of Glasgow has received £3m to host a research centre for semiconductor integration, 3D printing  and packaging.

The Automated Nano AnaLysing, characterisatiOn and additive packaGing sUitE (ANALOGUE) focus on rapid prototyping, packaging and characterisation of a wide range of semiconductor devices.

The centre will be based at the University’s Advanced Research Centre (ARC) with chip probing equipment, advanced packaging capabilities and additive electronics manufacturing for 3D printing.

The equipment will be automated as a single suite, making it the UK’s first machine-driven integrated assembly and characterisation line for semiconductor devices. ANALOGUE’s advanced automation will allow users to use the suite remotely, with support from on-site experts, helping to streamline the research process. 

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Industrial partners include ARM, PragmatIC, Inseto, Nano-Dimension, Vector Photonics, Touchlab, Printed Electronics, Kelvin Nanotechnology, Denchi Power, SeeQC, Quantum Science, Labman, Scotland 5G Centre, and CENSIS. 

A team of 23 academics and more than 100 researchers and students will make regular use of the facility and new developments prototyped at ANALOGUE could find use in biomedical implants, sustainable and biodegradable sensors, and quantum computing interfaces. 

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“This grant is a significant milestone for semiconductor research in the UK, which is a key part of the country’s economy. “The establishment of ANALOGUE represents a substantial advance in the UK’s semiconductor research infrastructure for heterogeneous integration and advanced packaging,” said Professor Hadi Heidari, Head of the University of Glasgow’s Electronics and Nanoscale Engineering Research Division, is the project’s principal investigator. 

The suite is supported by 27 external project partners including national facilities such as the Manufacturing Technology Centre (MTC) and the National Physical Laboratory (NPL), academic networks (EPSRC eFutures and E-Textiles), and top research universities.


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