3rd-generation IO-Link transceiver chip cuts power, package outline

3rd-generation IO-Link transceiver chip cuts power, package outline

New Products |
By eeNews Europe

Industrial systems designers, maxim says, now have a robust IOLink dual-channel transceiver that dissipates the lowest heat in the smallest package; IO-Link sensors contribute to the ‘Industry 4.0’ trend by bringing intelligence and control down to the factory floor. Sensors are getting smaller and need to deliver more functionality, while ensuring robust communications: power – says Maxim – is also critical because these sensors are small and it is difficult to dissipate heat. The MAX14827 dual-channel, 250 mA transceiver meets these requirements, while also integrating high-voltage functions commonly found in industrial sensors, including drivers and regulators.

It features two ultra-low power drivers with active reverse-polarity protection to reduce downtime. For sensors that use a microcontroller, a SPI interface is available with extensive diagnostics. For IO-Link operation, a three-wire UART interface is provided, allowing interfacing to the microcontroller UART. A multiplexed UART/SPI option allows using one serial microcontroller interface for shared SPI and UART interfaces. The device includes on-board 3.3V and 5V linear regulators for low-noise analog/logic supply rails.

Advantages include; a lower on-resistance (RON): 2.5 Ohm Ron (typical) saves more than 50% power; the WLP package saves 60% space; a 65V Abs Max rating enables flexible TVS protection selection.

In a WLP package (2.5 x 2.5 mm) or TQFN package (4 x 4 mm) and specified over the -40 to +125°C temperature range, pricing starts at $3.35 (1000). An evaluation kit is also available

Maxim Integrated; /

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