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4-pin 0.4mm-pitch logic package eases PCB assembly

4-pin 0.4mm-pitch logic package eases PCB assembly

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By eeNews Europe



Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective. The X2SON packages were designed to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only needed under that threshold). The company’s low-power AUP, AXP, LV and LVC technology families covering over one hundred logic solutions are now available in X2SON 8, 6, 5 and 4-pin packages. The new 4-pin X2SON4 package option reduces the footprint of the same function by 44% when compared to 5-pin X2SON5, and by up to 64% when compared to XSON packages. The larger pad pitch provides greater contact area, resulting in easier component placement, as well as improved joint strength and robustness.

Nexperia – www.nexperia.com

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