5 times more CSP LED modules shipping over the next 5 years, says Yole
CSP LEDs add value through power density offered from a small surface, with the first targeted application being smartphone flashes. As smartphones get thinner and add functions, so too must integrated components and modules. The small form factor and wide beam angle of CSP LEDs have also driven their use in TV backlighting units. Wide beam angles mean the pitch between LEDs can be larger, reducing the number of devices needed and in turn lowering backlight cost.
But CSP LEDs are also a means to develop new functions in lighting products and this will be the next growth driver for such LED device, according to the new report.
Some general lighting applications are likely to adopt these light sources to reduce the cost of the full system (lamp and/or luminaire). Their small size enables LED clusters, similar to COB LED modules but with more functionalities. CSP LED clusters promise tuneable, white and Human Centric Lighting intended to promote a person’s well-being, mood and health, and others smart lighting functions. In the mid-term, such devices will also help the development of Advanced Front Lighting Systems.
“We estimates that CSP LED modules represented less than 1% of the LED module business in 2016”, says Pierrick Boulay, Market & Technology Analyst at Yole Développement “However, with strong potential in multiple applications and the lighting industry getting experience with the integration of such technology, we forecast a market share of nearly 6% by 2021.”
As an example, Samsung made several strategic technical choices including a CSP manufacturing process to obtain a LED device at a very competitive manufacturing cost.
Chip-scale packages are new to the LED industry, but are the mainstay of the traditional semiconductor industry, where they improve reliability, thermal management and enable smaller packages.
“CSP LEDs can be less than a tenth of the size of high and middle power LEDs, increasing lumen density and simplifying integration into final products”, explains Dr Olivier Andrieu, R&D Project Director and System Architect at PISEO.
The CSP LED Lighting Module report also points out several challenges to overcome at the device manufacturing and module integration levels. These include colour uniformity, chemical stability, given there is little to no sealing off from the external environment, and control of optical properties like the radiation pattern.
Visit Yole Développement at www.yole.fr
Visit PISEO at www.piseo.fr
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