50W UV femtosecond laser cuts through SiC wafers and stacked OLED displays
Coherent has developed an industrial ultraviolet (UV) femtosecond laser with 50 W of output power that is ideal for high-speed, high-volume cutting of wafers via direct ablation, including silicon carbide, and stacked OLED displays.
The rapid growth in applications such as wafer grooving and precision cutting of display stacks for mobile and next-generation chips is accelerating the need for laser tools with higher output power that can process material at high speed with great precision.
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The Monaco 345-25-50 is the first 50 W 400 fs UV laser with industrial-grade performance, enabling high-precision cutting in very high volumes.
The laser delivers pulses with energies up to 25 µJ at repetition rates up to 2 MHz in the UV with a pulse width below 400 fs. It includes all the standard functionality of the Monaco platform, including pulse-on-demand, variable pulse width tuning, variable repetition rate, and flexible seeder burst mode.
“Our Monaco 345-25-50 is the latest addition to our highly successful Monaco industrial laser platform and represents the smallest 50 W femtosecond laser on the market,” said Allan Ashmead, Senior Vice President, Micro-Electronics & Instrumentation, North America.
“The Monaco product line is field-proven, with more than 800 systems installed throughout factories worldwide that operate around the clock, seven days a week, mass-producing medical devices as well as OLED displays for leading-edge consumer applications.”
The Monaco 345-25-50 extends Coherent’s Monaco product line of infrared and green lasers, and follows on the recent introduction of the new high-power and high-energy Monaco 1035‑150-150 infrared laser.
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