55m euros project ramps up power electronics production plans
The three-year project ‘eRamp’ project will partner policymakers and representatives from the project’s sponsors at the two-day eRamp kickoff event (April 2-3, 2014).
Dr. Reinhard Ploss CEO of Infineon Technologies AG, will kick off the event by meeting with Sabine von Schorlemer, Saxon State Minister for Higher Education, Research and the Fine Arts; Prof. Wolf-Dieter Lukas, department head at the BMBF (German Federal Ministry of Education and Research), the largest national sponsor; and with Dr. Andreas Wild, Executive Director of ENIAC Joint Undertaking, the funding provider of the European Union.
"The research results from eRamp will be an important contribution to even more efficiently use energy," explained Dr. Reinhard Ploss, CEO of Infineon Technologies AG. "Europe and Germany are distinguished by their characteristic knowledge and expertise. The partners in the eRamp project have the entire power electronics value creation chain in mind, from generation and transmission all the way to consumption of electric energy. Together we will create new knowledge and thus new products that will mean economic and ecological progress for Europe."
BMBF department head Prof. Wolf-Dieter Lukas added: "Power electronics is a key technology and a determining factor in the competitive ability of fundamental industry sectors in Germany and Europe. The cooperative approach of the European Commission and the German federal government in funding eRamp is a clear example of the benefits of joint action in Europe."
"The eRamp project, led by Infineon Technologies Dresden, brings the European industry for power electronics components to the forefront of innovation, with considerable impact on important areas of industry and everyday life, such as energy efficiency, electromobility, medicine and many more," said Dr. Andreas Wild, Executive Director of ENIAC Joint Undertaking.
From left to right: Prof. Wolf-Dieter Lukas, department head at the German Federal Ministry of Education and Research (BMBF); Dr. Andreas Wild, Executive Director ENIAC Joint Undertaking; Helmut Warnecke, Managing Director Infineon Technologies Dresden GmbH; Dr. Reinhard Ploss, CEO of Infineon Technologies AG; Sabine von Schorlemer, Saxon State Minister for Higher Education, Research and the Arts; Pantelis Haidas, Managing Director Infineon Technologies Dresden GmbH; Dr. Oliver Pyper, Project Leader eRamp, Infineon Technologies Dresden GmbH
eRamp research activities will focus on the rapid introduction of new production technologies and further exploration of chip packaging technologies for power semiconductors. The German project partners will investigate and develop new methods for speeding up the start of production runs.
In order to investigate research results for practical viability exactly where the new production technologies will be implemented, the German research partners will use existing pilot lines and comprehensive production expertise at various German sites, including Dresden (Infineon: power semiconductors based on 300 mm wafers), Reutlingen (Bosch: power semiconductors, smart power and sensors based on 200 mm wafers) and Regensburg (Infineon: chip packaging technologies for power semiconductors). Infineon, Osram and Siemens will also work together closely to research and construct testing equipment and demonstrators for the evaluation of newly developed chip embedding technologies.
In Germany, the Technical University of Dresden and West Saxon University of Applied Sciences Zwickau are also participating in research. In addition to Bosch, Infineon, Osram and Siemens, German business is represented by the companies SYSTEMA Dresden, an IT specialist vendor for automation in the manufacturing industry, HSEB Dresden, provider of optical inspection, review and installation, and SGS INSTITUT FRESENIUS, a leading vendor of chemical and physical laboratory analysis.
The Project eRamp is co-funded by grants from ENIAC Joint Undertaking and from Austria, Germany, the Netherlands, Romania, Slovakia and the UK.
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