5G mmWave antenna module design for ADAS and driverless cars

5G mmWave antenna module design for ADAS and driverless cars

Business news |
By Nick Flaherty

Taiwanese PCB maker Flexium has used tools from Ansys to analyze electromagnetic, thermal, and mechanical performance to improve the reliability and durability of its flexible 5G millimetre wave antenna designs.

The simulation tools boost antenna module designs that support the miniaturization of satellite and 5G mmWave technologies critical to advanced vehicle perception and autonomous vehicles

Within Flexium’s PCB layouts are numerous flexible print circuits (FPCs) responsible for critical connections that enable 5G communication in ADAS and AV applications. Any design deficiencies within these layouts can negatively impact FPC transmission characteristics responsible for vehicle perception.

To address these challenges, Flexium uses Ansys simulation software for the electromagnetic, thermal, and mechanical optimization of its FPC designs through efficient layout and material changes. Ansys tools also helped Flexium set specific parameters for board layout and materials, then create a reference library for future mmWave design verification.

The R&D team at Flexium also tested the durability and reliability of its PCB boards and explored new design ideas for 5G mmWave modules through layout and material experimentation at a relatively low cost.

“Ansys delivers the greatest predictive accuracy and yields the strongest results for us during PCB layout analysis critical to today’s ADAS and AV applications,” said Ming-Chi Cheng, president of Flexium. “Looking beyond 5G, we will continue to reference Ansys simulation to discover new methods for optical integration and communication that will help shape the future of our mmWave antenna module designs.”

“With Ansys, global PCB industry leaders like Flexium realize the freedom to explore possibilities in board application design, and successfully develop forward-thinking antenna solutions for high-frequency signal transceiver applications,” said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys.

“As the momentum behind miniaturization continues to build, our simulation solvers will accelerate the satellite, driverless, and related wireless signal modules powering this trend.”


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