5G SoC brings ‘smart and fast’ together for high-end smartphones
The Dimensity 5G chipset family, says the company, brings “smart and fast” together to power the world’s most capable 5G devices, and represents a step toward a new era of mobility – the fifth dimension – to spur industry innovation and let consumers unlock the possibilities of 5G connectivity.
“We chose the name ‘Dimensity’ to highlight how our 5G solutions are driving new waves of innovation and experiences, much like the fabled fifth dimension,” says MediaTek President Joe Chen. “Our first announced chip, MediaTek Dimensity 1000, gives consumers a significantly faster, more intelligent and all-around incredible mobile experience.”
The Dimensity series integrates the company’s 5G modem in one compact design, delivering significant power savings compared to competing solutions. The Dimensity 1000 5G SoC supports 5G two carrier aggregation (2CC CA) and offers 4.7-Gbps downlink and 2.5-Gbps uplink speeds over sub-6-GHz networks.
The chipset is designed to support standalone and non-standalone (SA/NSA) sub-6-GHz networks, and includes multi-mode support for every cellular connectivity generation from 2G to 5G. It also integrates the latest Wi-Fi 6 and Bluetooth 5.1+ standards, offering more than 1 Gbps throughput in both downlink and uplink speeds.
The SoC pairs four Arm Cortex-A77 cores operating up to 2.6 GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0 GHz. This design, says the company, enables an optimal balance of high performance and power efficiency. The chipset is also claimed to be the world’s first to pack Arm Mali-G77 GPU to enable seamless streaming and gaming at 5G speeds.
The Dimensity 1000 also comes with a new MediaTek AI Processing Unit – APU 3.0 – offering more than double the performance of the previous generation APU at 4.5 TOPS.
The SoC offers the following features and technology:
- Dual 5G SIM: With the world’s first dual 5G SIM technology, in addition to support for services such as Voice over New Radio (VoNR), the 5G SoC delivers seamless connectivity across networks and offers consistent speeds.
- Power Efficient 5G Modem: The chipset’s integrated 5G modem delivers extreme energy efficiency and is a more power efficient design than competing solutions. Its compact, integrated design also lets brands use the extra space for other features like a bigger battery or larger camera sensors.
- Seamless Handover: With 5G carrier aggregation, the chipset posts higher average speeds and performs a seamless handover between two connection areas (high speed layer and coverage layer) for seamless high speed connections when users are on the go.
- Imaging: With the world’s first five-core image signal processor (ISP) combined with the company’s Imagiq+ technology, the chipset supports 80MP cameras sensors at 24 frames per second and a range of multi-camera options such as 32+16MP dual cameras.
- APU Camera & Video Support: The APU supports advanced AI-camera enhancements for autofocus, auto exposure, auto white balance, noise reduction, high-dynamic-range (HDR), and facial detection, along with multi-frame video HDR capability.
- Graphics and Video: The chipset features support for Full HD+ displays up to 120 Hz and 2K+ up to 90 Hz. Dimensity 1000 is the first mobile SoC to support Google AV1 format up to 4K resolution at 60 fps.
Dimensity 1000 is designed for global sub-6-GHz 5G networks that are launching in Asia, North America, and Europe. The first Dimensity powered devices will start hitting the market in Q1 of 2020.
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