60W System-in-Package SiP eliminates heatsink
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Infineon Technologies has developed a fully integrated 60W system power controller for designs up to 60W with its seventh generation power MOSFET.
The CoolSET System-in-Package (SiP) has a universal input voltage range of 85 – 305 V AC. Reducing the input voltage to 220V +/- 20% incrases the power output to 90W for the ICE186EM.
The SiP integrates a 950 V startup-cell, an 800 V avalanche CoolMOS P7 SJ MOSFET, a ZVS primary flyback controller, a secondary-side synchronous rectification (SR) controller and reinforced isolated communication through Infineon’s proprietary CT Link technology.
The 800V MOSFET with low RDS(ON) of 480mO eliminates the need for an external heat sink, reducing system size and complexity with under 30mW of standby power. The controller supports zero-voltage switching (ZVS) flyback operation, which enables low switching losses and low EMI signature, while also enhancing system reliability and robustness.
This makes it suitable for a wide range of applications, from major home appliances to AI servers, allowing developers to meet stringent energy standards, supporting future-proof power solutions for modern designs.
The surface mount DSO package measures 12.8 x 7.5 x 2.65mm, significantly minimizing PCB space requirements by reducing the number of discrete components which also lowers the bill of materials. A comprehensive set of advanced protection features simplifies system integration.
Samples of the CoolSET System in Package (SiP) are available to order and Infineon will show a demo version at PCIM Europe 2025.
www.infineon.com/cms/en/product/promopages/coolset-sip/
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