70x70mm computer board sports AMD Embedded G-Series SoC
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H6069 is compliant with the Qseven standard revision 2.0 and the computer module measures 70x70mm.The H6069 fits embedded applications that require powerful CPU and graphics performance in combination with low power consumption and extremely compact size.
The Radeon 8000 series GPU gives the processor a graphics performance increased by about 20% compared to the previous generation AMD Embedded G-Series APU. The GPU can be used for general purpose GPU computing (GPGPU) by taking advantage of AMD’s Open CL support. H6069 has a rich set of I/O interfaces including four PCI Express ports, two USB 3.0, four USB 2.0 and three SATA ports. Dual independent displays can be connected to dual 24-bit LVDS and one of the new digital display interfaces DVl, HDMI or DisplayPort. The module supports up to 4GB onboard soldered DDRIII DRAM, as well as an on-board soldered BGA SATA Flash SSD of up to 32GB.
Hectronic has developed the BIOS for the module based on the Phoenix SecureCore UEFI BIOS, and will also provide BSPs for XP Embedded, Windows Embedded Standard 7, Windows Embedded 8 and Linux.
The first versions of the H6069 module is based on the AMD Embedded G-Series GX-210HA SOC which uses a dual core CPU, 1.0GHz clock frequency and has a power consumption of 9W TDP. Early access samples will be available to key OEM customers December 10, 2013. Versions of H6069 specified for operation in an industrial temperature range (-40°C to 85°C) are planned for introduction in March, 2014.
Visit Hectronic at www.hectronic.se
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